COB UV Modules

Home / UV LED Modules / COB UV Modules

COB UV modules integrate multiple UV LED chips onto a compact substrate, providing high-intensity UV output and efficient heat dissipation for industrial applications. These modules are suitable for curing adhesives, inks, and coatings, as well as compatible UV exposure and fluorescence-based inspection systems. Available in 365nm, 385nm, 395nm, and 405nm configurations, they can be customized in size, power, and electrical interface to meet specific equipment integration requirements.

Key Features:

High Power Density:
The compact chip-on-board configuration delivers concentrated UV output, supporting efficient curing of compatible materials in equipment with limited installation space.
Thermally Superior:
The direct mounting of LED chips on thermally conductive substrates such as aluminum or ceramic allows heat to be shed optimally, thus increasing the modules lifespan.
Illumination Uniformity:
Critical for advanced curing and inspection processes to ensure smooth, even UV radiation with minimized hotspots.
Multiple Configurable Geometries:
These include round and square, rectangular as well as other shapes which fit the fixture or installation requirements.
Operationally Unchanged:
Environmental and cost impacts are reduced due to low power consumption and instant-on operations.

Typical Applications:

UV curing of industrial adhesives, inks, and coatings.
UV printing and coating processes requiring concentrated irradiation.
UV exposure processes for compatible electronic materials.
Fluorescence excitation for industrial inspection and quality control.
Integration into compact industrial UV curing equipment.

How to Select the Best COB UV Modules?

Fit To Application:

Assess if the application utilizes high-peak irradiance handheld UV devices requiring high spatial uniformity and precision for measurement.
Selection of Wavelength:

Choose from 365nm, 385nm, 395nm, or 405nm based on the absorption characteristics of the UV-curable material or the fluorescence response required by the application. Confirm wavelength compatibility with the material specifications before selecting a module.
Power and Intensity:

Confirm outputs in mW/cm² meets your process throughput and precision depth requirements.
Design based on Heat Transfer:

Ensure the module utilizes advanced substrates and cooling designs for continuous or intermittent operation cycles demanding high thermal management.
Electrical Compatibility:

Check rated voltage and current, integrated drivers, and if external drivers are needed.
Mechanical Integration:

Consider IP ratings for environmental sealing and the dimensioning of the module for the intended equipment.
Dependability:

Seek out pertinent to your operational parameters lifetime documentation, thermal cycle testing, and electrostatic discharge shielding micrometric filters.
Further Specifications:

For increased flexibility regarding use, integration, and optimization, the opto-mechanical interfaces, feedback systems, and closed-loop control algorithms are customizable.